Five Industries
Where we deliver end-to-end
① Carbon & Graphite Electrode
Cleaning, machining, precision grinding and fully automatic lines for electrode, nipple, carbon block and cathode plants. 90% domestic market share.
② Semiconductor (SiC)
Wafer and substrate slicing for SiC, GaN and GaAs. Endless wire saws plus dry-cut capability for contamination-free R&D.
③ Photovoltaic Silicon
Ingot cropping-to-slicing flow: silicon rod cutters paired with high-throughput multi-wire saws for maximum wafer yield.
④ Sapphire & LED
Substrate and LED wafer production with ultra-low kerf loss and mirror-smooth surfaces on endless wire saws.
⑤ Ceramic & Optical
Alumina, zirconia, ferrite, quartz and optical glass cutting on vertical and dry-cut wire saws, including water-sensitive grades.
How we engage
From sample to production
Free sample cut
We cut your material and return process parameters plus a sample.
Process design
Equipment selection, line layout and yield modelling.
Turnkey delivery
Installation, integration, commissioning and operator training.
Lifecycle support
Spare parts, preventive maintenance and remote diagnosis.
Not sure which machines your process needs?
Tell us your material and target output — we’ll design the solution.