The Challenge
Why This Material Is Demanding
💎
High hardness (9 Mohs)
Slow cutting and wire wear without high-speed endless-loop technology.
🔬
Subsurface damage (SSD)
SSD, edge chipping and crystal stress reduce LED yield and raise polishing cost.
💥
Edge chipping
Wafer breakage and yield loss from poor feed and reversal marks.
🧭
Crystal orientation
Precise angular cutting needs programmable R-axis rotary control.
Our Solution
How Prominer CNC Approaches It
Endless Wire Saw (HXB Series)
Low-SSD slicing for 150/200 mm sapphire with precision tension ±0.5 N.
Typical Parameters
Reference Cutting Window
| Parameter | Value |
|---|---|
| Wire diameter | 0.18–0.25 mm |
| Wire speed | 6–20 m/s |
| Feed rate | 0.2–0.5 mm/min |
| Wire tension | ±0.5 N |
| Typical kerf loss | 0.25–0.35 mm |
| Target SSD | <6 µm |
| Target surface Ra | <0.5 µm |
Proven Results
Real-World Outcomes
LED
Korean LED Maker
SSD reduced 73% (20→5.4 µm), 99%+ yield.
$1.8M/yr Saved
RF
Japanese GaN RF Fab
Crystal orientation ±0.03°, 6″ (150 mm) wafer.
±0.03° Orientation
Mini-LED
Chinese Mini-LED
Chipping reduced 90% on 2″ wafers.
Chipping ↓90%
Cutting this material? Let’s benchmark it.
Send us a sample and we’ll run a free test cut and return optimal parameters plus a sample.