The Challenge
Why This Material Is Demanding
Thermal cracking
Brittle ceramics fail catastrophically from heat — needs temperature-controlled or dry cutting.
Edge chipping
Component failure and quality loss from uncontrolled feed.
Micro-cracking (optical)
Any subsurface damage degrades optical performance.
Coolant contamination
Electronic ceramics and water-sensitive grades cannot accept fluid contact.
Our Solution
How Prominer CNC Approaches It
Endless Wire Saw (wet, HXB)
Precision wet cutting with kerf reduction and ±0.02 mm accuracy.
Dry-Cut Saw (HXWV)
Zero-contamination dry cutting for electronic ceramics and water-sensitive grades.
Vertical Wire Saw (HXV)
Large-format optics up to 800×800 mm for telescope and astronomy glass.
Typical Parameters
Reference Cutting Window
| Parameter | Value |
|---|---|
| Wire diameter | 0.20–0.30 mm |
| Wire speed | 5–15 m/s |
| Feed rate | 0.2–0.5 mm/min |
| Wire tension | ±0.5 N |
| Typical kerf loss | 0.28–0.40 mm |
| Target chipping | <0.1 mm |
| Target surface Ra | <0.5 µm |
Proven Results
Real-World Outcomes
Japanese Ferrite Processor
Chipping down 90%, zero contamination (dry-cut).
Dry-Cut, Zero Contam.
German Alumina
Kerf reduced 47% (2.5→1.3 mm), ±0.02 mm precision.
±0.02 mm
American Laser Optics
Zero micro-cracks, kerf below 80 µm.
Zero Micro-cracks
Cutting this material? Let’s benchmark it.
Send us a sample and we’ll run a free test cut and return optimal parameters plus a sample.